PLC controller with touch screen provides an intuitive graphical interface and real time process representation
Flexible shelf architecture allows processing of a wide variety of part carriers in either direct or downstream plasma mode
13.56 MHz RF generator has automatic impedance matching for unparalleled process reproducibility
Proprietary software control system generates process and production data for statistical process control
ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.