Search Scholars@NDSU
  1. Home
  2. Equipment Classifications
  3. Process Equipment: Physical
  4. Packaging
  5. Dicing

Dicing

AUTOMATIC WAFER DICING SYSTEM

Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Dicing

ADT Dicing Saw (cuts) wafers into individual chips or cuts substrates into individual packages

University Tag Number: 
171794
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B

Related Classifications