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Equipment Classifications
Process Equipment: Physical
Packaging
Dicing
Dicing
AUTOMATIC WAFER DICING SYSTEM
Inventory Classification
Process Equipment: Physical
Packaging
Dicing
ADT Dicing Saw (cuts) wafers into individual chips or cuts substrates into individual packages
University Tag Number:
171794
Availability:
Contact Custodian for availability
Custodian
Frederik Haring
Department
RCA Research Operations
Location
Research II
Room Number:
126B
Related Classifications
Encapsulation
Wafer/Chip Bonding
Wire Bonding