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Dicing

AUTOMATIC WAFER DICING SYSTEM

Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Dicing

ADT Dicing Saw (cuts) wafers into individual chips or cuts substrates into individual packages

University Tag Number: 
171794
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B

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