K&S Tab Bonder ultrasonically welds thin metal tabs or fingers to make electrical connections.
West Bond Manual Wire Bonder ultrasonically welds very thin aluminum or gold wire to make electrical connection.
Used to develop photo resist on wafers and substrates up to 230 mm. Adjustable speed from 50 to 8,000 rpm with ±10 rpm resolution. Dual N2 aspirated atomizing nozzles. Constant 2-3 psi nozzle pressure regardless of fluid level.
Places many types and sizes of die on various size substrates.
Hexamethyldisilazane (HMDS) is used to improve photoresist adhesion to the silicon wafers. Programmable cycles for HMDS application. Capable throughput of 400+ wafers per hour.