The WS-400 is a single wafer, manual dispense spin processor with a nitrogen purged process chamber and is manipulated by a digital controller. The wafer is held in place during process by means of a vacuum chuck. The digital controller has twenty programs each with fifty-one steps stored in non-volatile memory. The program sizes and steps can be changed.
Used to develop photo resist on wafers and substrates up to 230 mm. Adjustable speed from 50 to 8,000 rpm with ±10 rpm resolution. Dual N2 aspirated atomizing nozzles. Constant 2-3 psi nozzle pressure regardless of fluid level.
Hexamethyldisilazane (HMDS) is used to improve photoresist adhesion to the silicon wafers. Programmable cycles for HMDS application. Capable throughput of 400+ wafers per hour.
