Wafer/Chip Bonding

Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

K&S Tab Bonder ultrasonically welds thin metal tabs or fingers to make electrical connections.

University Tag Number: 
171747
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

West Bond Manual Wire Bonder ultrasonically welds very thin aluminum or gold wire to make electrical connection.

University Tag Number: 
173261
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

Used to develop photo resist on wafers and substrates up to 230 mm. Adjustable speed from 50 to 8,000 rpm with ±10 rpm resolution. Dual N2 aspirated atomizing nozzles. Constant 2-3 psi nozzle pressure regardless of fluid level.

University Tag Number: 
178572
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

Places many types and sizes of die on various size substrates.

University Tag Number: 
173261
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

Hexamethyldisilazane (HMDS) is used to improve photoresist adhesion to the silicon wafers. Programmable cycles for HMDS application. Capable throughput of 400+ wafers per hour.

University Tag Number: 
170494
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122B

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