Wire Bonding

Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wire Bonding

K&S 8028 Wire Bonder ltrasonically welds very thin gold wire (0.001 thick, 25 micron) to make electrical connections.

University Tag Number: 
171746
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wire Bonding

Typically, “ball bonding” applications are associated with thermocompression (T/C) and thermosonic (T/S) joining methods.  T/C utilizes pressure and temperature from about 150 degrees C (for most common applications) to create an intermetallic bond.  T/S, on the other hand, adds ultrasonic energy from the previous process.  With both methods, however, a “free air ball” is being created by a spark from an “electronic flame off” or EFO underneath the capillary before bonding takes place.

University Tag Number: 
173162
Availability: 
Unknown
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wire Bonding

The Type-36 is one of the smallest and fastest core alignment fusion splicers available today. It s a portable, fully automatic, self-contained instrument for creating low-loss optical fiber splices in both field and factory environments. Sumitomo s innovative dual microscope fiber observation system eliminates the need for mirrors, providing faster operation and reduced damage potential. It is designed to work with a variety of fiber types including single-mode, multimode, dispersion shifted, and other specialty fiber.

University Tag Number: 
188076
Availability: 
Contact Custodian for availability
  • Ying Huang
Location
Ehly Hall
Room Number: 
115

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