Electrodeposition

Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Electrodeposition

Used to create a patterned layer of metal on a conductive surface. Capable of electroplating both 150mm and 200mm wafers. Plating height can range from a few microns to fifty or more. Up to 900 ma current.

University Tag Number: 
180730
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
124A
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Electrodeposition

Dimatix DMP-2831
FUJIFILM Dimatix has leveraged its piezoelectric inkjet technology and MEMS fabrication processes with its extensive inkjet product and system knowledge to produce a materials printer specifically designed for R&D and feasibility testing.
The Dimatix Materials Printer (DMP) is a cost-effective, easy-to-use precision materials deposition system.

University Tag Number: 
180761
Availability: 
Contact Custodian for availability
  • Aaron Reinholz
Location
Research II
Room Number: 
152
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Electrodeposition

Coating depositions are conducted on a Symyx® bench top unit that can generate coating films using casting or drawdown methods. The unit features 12 mini blenders for high shear mixing of materials with short working times. This allows for reactive components to be added just before the films are formed. Liquid coatings and reagents are transferred using 1ml positive displacement tips and can be positioned in heated and magnetically stirred bays. Microtiter format substrates are delivered to the system with a Velocity 11 BenchCel 4xTM for coating deposition.

University Tag Number: 
169558
Availability: 
Contact Custodian for availability
  • James Bahr
Location
Research I Addition
Room Number: 
1226