Sputterer

Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Sputterer

CMS-18 thin film deposition system offers wide possibilities for preparation of known and new materials and structures in the form of thin films.
Four magnetron sources allow preparation of various materials (metal, semiconductor, dielectric, metastable etc.) in a wide range of compositions and structures using deposition, code position, sequential deposition and reactive deposition processes.

University Tag Number: 
182200
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122A
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Sputterer

The Lesker CMS 18 Deposition System (PVD 4) is a 4 source RF, 2 source pulsed DC sputter deposition system.  Each source can accommodate 3” diameter targets of maximum 0.250” thickness. Conductors are best suited for DC sputtering. Insulators are best suited for RF sputtering. Oxide/nitride deposition is also possible via reactive sputtering, by utilizing pulsed DC sputtering and careful gas flow control.

University Tag Number: 
182200
Availability: 
Contact Custodian for availability
  • James Bahr
Location
Research II - Clean room
Room Number: 
122A
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Sputterer

Cressington 108 Sputter Coaters are ideal for routine sample preparation. Compact, economical and simple to operate, they offer rapid pumpdown times, fine-grain coatings and negligible sample heating. Cool, fine-grain sputtering is achieved with a very efficient dc magnetron head. A quick-change target method allows a range of metals to be used. The safety interlocked sputtering supply is fully variable and setting the sputter current is not influenced by vacuum level.

University Tag Number: 
194015
Availability: 
Contact Custodian for availability
  • Jayma Moore
  • Scott Payne
Location
USDA NCSL Lab
Room Number: 
107
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Sputterer

The Cressington Coater offers real solutions to the problems encountered when coating difficult samples for FE-SEM.  To minimize the effects of grain size the unit offers a full range of coating materials and gives unprecedented control over thickness and deposition conditions. To minimize charging effects the stage design and wide range of operating pressures allows precise control of the uniformity and conformity of the coating. The HIGH/LOW chamber configuration allows easy adjustment of working distance.

University Tag Number: 
184473
Availability: 
Contact Custodian for availability
  • Jayma Moore
  • Scott Payne
Location
USDA NCSL Lab
Room Number: 
EMC 107
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Sputterer

200mm spin coater with GYRSET system for better uniformity and lower resin consumption, stainless base cabinet, multiple dispense capability for up to 2 photoresist, 1 nitrogen, and 1 solvent line. Maximum 5000 rpm/sec acceleration, motorized dispense arm, Cybor 5026 pump (05026-60-57-52C6-OP-C6-OK) with 512 power supply, and controller.

University Tag Number: 
170500
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122B
Inventory Classification
  • Process Equipment: Physical
  • Thin Film Deposition
  • Sputterer

CMS-18 thin film deposition system offers wide possibilities for preparation of known and new materials and structures in the form of thin films.
Four magnetron sources allow preparation of various materials (metal, semiconductor, dielectric, metastable etc.) in a wide range of compositions and structures using deposition, code position, sequential deposition and reactive deposition processes.

University Tag Number: 
173003
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122C