Used to create a patterned layer of metal on a conductive surface. Capable of electroplating both 150mm and 200mm wafers. Plating height can range from a few microns to fifty or more. Up to 900 ma current.
The BX61 microscope has a built-in motorized Z-drive (0.01 m resolution), and can be equipped with a motorized nosepiece, condenser, reflected light or fluorescence illuminator, and up to three 6-position filter wheels in various locations. The sixteen handswitch buttons and eight frame buttons are fully programmable through a computer interface, and key configurations can be defined in the software.
High-precision wafer probe station for device characterization and modeling Re-configurable for multiple applications: DC, RF, mmW, FA, WLR and more Excellent EMI shielding for low noise measurement Wide range of temperature options from -60 to 300°C and higher
CheckSum Manufacturing Defects Analyzers (MDAs) provide the capability to quickly and easily test assemblies for common manufacturing defects such as incorrect, missing or misoriented components, and opens and shorts.
LECO’s CHNS-932 Elemental Analyzer is capable of determining the amount of carbon, hydrogen, nitrogen and sulfur present in a homogeneous aliquot weighing approximately 0.6–1.6mg (2.0mg maximum). An aliquot is weighed and placed into either a tin or silver capsule in which it is appropriately crimped. During the analysis, the aliquot is dropped into a furnace held at 1,000°C. At the same time the sample drops into the furnace, a dose of oxygen is released into the furnace. This causes the sample to readily combust forming gases of COX, H2O, N2, and SOX.
The Lesker CMS 18 Deposition System (PVD 4) is a 4 source RF, 2 source pulsed DC sputter deposition system. Each source can accommodate 3” diameter targets of maximum 0.250” thickness. Conductors are best suited for DC sputtering. Insulators are best suited for RF sputtering. Oxide/nitride deposition is also possible via reactive sputtering, by utilizing pulsed DC sputtering and careful gas flow control.
CMS-18 thin film deposition system offers wide possibilities for preparation of known and new materials and structures in the form of thin films.
Four magnetron sources allow preparation of various materials (metal, semiconductor, dielectric, metastable etc.) in a wide range of compositions and structures using deposition, code position, sequential deposition and reactive deposition processes.