Vice President for Research and Creative Activity

Department Number: 
4000

Department Inventory

Designed for use with the JEOL JSM-6490LV scanning electron microscope, where it permits live SEM observation/recording of visible changes in tested materials through failure.  Also can be used with the optical microscope or as a data-logging test module, with no image display.

University Tag Number: 
174606+
Availability: 
Contact Custodian for availability
  • Core Labs
  • Jayma Moore
  • Scott Payne
Location Description
USDA NCSL Lab
Room Number: 
EM Lab 111

TA Instruments’ Q500 is a high performance research grade thermogravimetric analyzer equipped with a responsive low-mass furnace, sensitive thermobalance, and efficient horizontal purge gas system. Its robust easy-to-use software makes the Q500 perfect for the multi-user laboratory where a wide variety of TGA applications are conducted and where future expansion of analytical work is anticipated. (TA Instruments Webpage: Q500 Thermogravimetric Analyzer) Thermogravimetric Analysis (TGA) measures weight changes in a material as a function of temperature or time under a controlled atmosphere.

University Tag Number: 
170419
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Aaron Reinholz
Location Description
Research I Addition
Room Number: 
1132

TA Instruments’ TMA Model 2940 is an industry standard research grade thermomechanical analyzer with flexibility in operating modes, test probes, fixtures, and available signals. The open architecture allows for easy sample loading and probe placement. Flexibility of sample thermocouple allows for precise positioning in order to optimize temperature measurement.

University Tag Number: 
167695
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Dean Webster
Location Description
Research 1A
Room Number: 
1132

Toho FLX-2320-S Thin Film Stress Measurement Systems offer industry standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates up to 200mm in diameter. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools determine and analyze surface stress caused by deposited thin films. The Toho FLX systems offer outstanding value in a variety of comprehensive Stress Measurement Solutions that utilize advanced measurement principles.

University Tag Number: 
182235
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Greg Strommen
Location Description
Research II
Room Number: 
122B

CMS-18 thin film deposition system offers wide possibilities for preparation of known and new materials and structures in the form of thin films.
Four magnetron sources allow preparation of various materials (metal, semiconductor, dielectric, metastable etc.) in a wide range of compositions and structures using deposition, code position, sequential deposition and reactive deposition processes.

University Tag Number: 
173003
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Greg Strommen
Location Description
Research II
Room Number: 
122C

The JEOL JEM-100CX II is a tungsten-filament 100kV transmission electron microscope.  Digital imaging with Gatan Erlangshen ES500W camera, Gatan Digital Micrograph software.

University Tag Number: 
165584
Availability: 
Contact Custodian for availability
  • Core Labs
  • Jayma Moore
  • Scott Payne
Location Description
USDA NCSL Lab
Room Number: 
EM Lab 113

High-resolution 200-kV LaB6 analytical transmission electron microscope system (NSF MRI #0821655).  Energy dispersive X-ray spec­trometry (EDS), scanning transmission electron microscopy (STEM), and parallel electron energy-loss spectrometry (EELS) for micro­analysis.  Mag­ni­fications of 2,000 to 1,500,000 times; optimal resolution 0.23 nm.  Gatan dimple grinder and Gatan Precision Ion Polishing System (PIPS) for sample preparation.

University Tag Number: 
179927
Availability: 
Contact Custodian for availability
  • Core Labs
  • Jayma Moore
  • Scott Payne
Location Description
USDA NCSL Lab
Room Number: 
EMC116-117

Places many types and sizes of die on various size substrates.

University Tag Number: 
173261
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Frederik Haring
Location Description
Research II
Room Number: 
126A
Inventory Classification

ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.

University Tag Number: 
170498
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Greg Strommen
Location Description
Research II
Room Number: 
122C

Annealing and densification furnace. Capable of wafer sizes up to 150mm. Temperature range of 200 - 850 °C. Gases used: N2H2, N2, Ar, O2. System can also be setup for 1200 °C with 100 mm wafers.

University Tag Number: 
173268
Availability: 
Contact Custodian for availability
  • RCA Research Operations
  • Greg Strommen
Location Description
Research II
Room Number: 
122C