Designed for use with the JEOL JSM-6490LV scanning electron microscope, where it permits live SEM observation/recording of visible changes in tested materials through failure. Also can be used with the optical microscope or as a data-logging test module, with no image display.
TA Instruments’ Q500 is a high performance research grade thermogravimetric analyzer equipped with a responsive low-mass furnace, sensitive thermobalance, and efficient horizontal purge gas system. Its robust easy-to-use software makes the Q500 perfect for the multi-user laboratory where a wide variety of TGA applications are conducted and where future expansion of analytical work is anticipated. (TA Instruments Webpage: Q500 Thermogravimetric Analyzer) Thermogravimetric Analysis (TGA) measures weight changes in a material as a function of temperature or time under a controlled atmosphere.
TA Instruments’ TMA Model 2940 is an industry standard research grade thermomechanical analyzer with flexibility in operating modes, test probes, fixtures, and available signals. The open architecture allows for easy sample loading and probe placement. Flexibility of sample thermocouple allows for precise positioning in order to optimize temperature measurement.
Toho FLX-2320-S Thin Film Stress Measurement Systems offer industry standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates up to 200mm in diameter. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools determine and analyze surface stress caused by deposited thin films. The Toho FLX systems offer outstanding value in a variety of comprehensive Stress Measurement Solutions that utilize advanced measurement principles.
CMS-18 thin film deposition system offers wide possibilities for preparation of known and new materials and structures in the form of thin films.
Four magnetron sources allow preparation of various materials (metal, semiconductor, dielectric, metastable etc.) in a wide range of compositions and structures using deposition, code position, sequential deposition and reactive deposition processes.
High-resolution 200-kV LaB6 analytical transmission electron microscope system (NSF MRI #0821655). Energy dispersive X-ray spectrometry (EDS), scanning transmission electron microscopy (STEM), and parallel electron energy-loss spectrometry (EELS) for microanalysis. Magnifications of 2,000 to 1,500,000 times; optimal resolution 0.23 nm. Gatan dimple grinder and Gatan Precision Ion Polishing System (PIPS) for sample preparation.
ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.