THIN FILM STRESS MEASUREMENT

Toho FLX-2320-S Thin Film Stress Measurement Systems offer industry standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates up to 200mm in diameter. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools determine and analyze surface stress caused by deposited thin films. The Toho FLX systems offer outstanding value in a variety of comprehensive Stress Measurement Solutions that utilize advanced measurement principles.