BUMP PLATING MACHINE
Inventory Classification
Used to create a patterned layer of metal on a conductive surface. Capable of electroplating both 150mm and 200mm wafers. Plating height can range from a few microns to fifty or more. Up to 900 ma current.
University Tag Number:
180730
Serial Number:
MB-08111 08113 08114
Availability:
Contact Custodian for availability
Location
Research II
Room Number:
124A
Acquisition Date:
January 22, 2009