TRION TECHNOLOGY PHANTOM II

Inventory Classification

ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.

University Tag Number: 
170498
Serial Number: 
PHTII0169
Availability: 
Contact Custodian for availability
Location
Research II
Room Number: 
122C
Acquisition Date: 
June 1, 2004