Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning. Dimple grinding also offers a means of producing quality TEM specimens having a large central area only a few microns thick surrounded by a robust outer rim. This eliminates special handling techniques for fragile specimens.
Precision Ion Polishing System (PIPS™) The PIPS™ is a user-friendly precision ion polisher designed to produce high quality, TEM specimens with minimal effort. The PIPS™ is a dedicated low angle ion polishing unit with high milling rates. The standard milling angle is 4°.
Produces a clean polished cross section of almost any material at 90 degrees to the sample surface--ideal for measurement of multilayered structures. Useful for difficult-to-polish soft materials (Cu, Al, Au, solder, polymers) as well as difficult-to-cut hard materials (ceramic, glass, Si) and composites.
Scanning function for easy determination of parameters LectroPol-5 is equipped with a unique scanning function. The sample is placed on the polishing table and a pre-defined voltage range is scanned to determine the current density curve. This curve is used to define the correct voltage for both polishing and etching.
The ProtoMat S63 is ideal for printed circuit board prototyping applications ranging from digital to RF, offering a great mix of performance and price. The system is capable of producing mutliple design iterations in a single day and has the features that make in-house prototyping the choice method for PCB R&D.
Spectron laser systems in now part of GSI Lumonics. The GSI Lumonics spectron laser series has applications in the areas of laser marking, micromachining, scribing, engraving, etching, cutting, welding, annealing. This is a pulsed Nd:YAG laser that can be operated in Q-Switched or long pulse mode.
PLC controller with touch screen provides an intuitive graphical interface and real time process representation
Flexible shelf architecture allows processing of a wide variety of part carriers in either direct or downstream plasma mode
13.56 MHz RF generator has automatic impedance matching for unparalleled process reproducibility
Proprietary software control system generates process and production data for statistical process control
The PLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 9" or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³). The single laser platform supports a power range of 10 to 75 watts with one 10.6µ CO2 laser source or one 9.3µ CO2 30 watt or 50 watt laser source.
ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.