Etching

Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Mechanical

Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning.  Dimple grinding also offers a means of producing quality TEM specimens having a large central area only a few microns thick surrounded by a robust outer rim. This eliminates special handling techniques for fragile specimens.

University Tag Number: 
179924
Availability: 
Contact Custodian for availability
  • Jayma Moore
  • Scott Payne
Location
USDA NCSL lab
Room Number: 
EMC 107
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Ion Beam Milling

Precision Ion Polishing System (PIPS™) The PIPS™ is a user-friendly precision ion polisher designed to produce high quality, TEM specimens with minimal effort. The PIPS™ is a dedicated low angle ion polishing unit with high milling rates. The standard milling angle is 4°.

University Tag Number: 
179925
Availability: 
Contact Custodian for availability
  • Jayma Moore
  • Scott Payne
Location
USDA NCSL Lab
Room Number: 
EMC 107
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Ion Beam Milling

Produces a clean polished cross section of almost any material at 90 degrees to the sample surface--ideal for measurement of multilayered structures. Useful for difficult-to-polish soft materials (Cu, Al, Au, solder, polymers) as well as difficult-to-cut hard materials (ceramic, glass, Si) and composites.

University Tag Number: 
184470
Availability: 
Contact Custodian for availability
  • Jayma Moore
  • Scott Payne
Location
USDA NCSL Lab
Room Number: 
EMC 107
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Mechanical

Scanning function for easy determination of parameters LectroPol-5 is equipped with a unique scanning function. The sample is placed on the polishing table and a pre-defined voltage range is scanned to determine the current density curve. This curve is used to define the correct voltage for both polishing and etching.

University Tag Number: 
179297
Availability: 
Contact Custodian for availability
  • Rob Sailer
Location
Dolve Hall
Room Number: 
136
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Ion Beam Milling

LPKF ProtoMat® S100 High Performance PCB Prototyping for all applications

■ Ideal for RF and microwave circuitry on all substrates

■ Non-contact processing of surface sensitive materials

■ Superior milling speed, resolution and accuracy

■ Automatic tool change for unmatched ease-of-use and unattended operation

■ Vacuum table and fiducial recognition camera available

University Tag Number: 
182191
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
112
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Fine mechanical milling

The ProtoMat S63 is ideal for printed circuit board prototyping applications ranging from digital to RF, offering a great mix of performance and price. The system is capable of producing mutliple design iterations in a single day and has the features that make in-house prototyping the choice method for PCB R&D.

University Tag Number: 
186965
Availability: 
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  • Benjamin Braaten
Location
Electrical Engineering
Room Number: 
205
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Laser

Spectron laser systems in now part of GSI Lumonics. The GSI Lumonics spectron laser series has applications in the areas of laser marking, micromachining, scribing, engraving, etching, cutting, welding, annealing.  This is a pulsed Nd:YAG laser that can be operated in Q-Switched or long pulse mode. 

University Tag Number: 
139880
Availability: 
Contact Custodian for availability
  • John Hershberger
Location
Ladd Hall
Room Number: 
3
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Plasma

PLC controller with touch screen provides an intuitive graphical interface and real time process representation
Flexible shelf architecture allows processing of a wide variety of part carriers in either direct or downstream plasma mode
13.56 MHz RF generator has automatic impedance matching for unparalleled process reproducibility
Proprietary software control system generates process and production data for statistical process control

University Tag Number: 
171765
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Laser

The PLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 9" or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³). The single laser platform supports a power range of 10 to 75 watts with one 10.6µ CO2 laser source or one 9.3µ CO2 30 watt or 50 watt laser source.

University Tag Number: 
194150
Availability: 
Contact Custodian for availability
  • Ben Bernard
Location
Renaissance Hall
Room Number: 
420A
Inventory Classification
  • Process Equipment: Physical
  • Etching
  • Plasma

ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.

University Tag Number: 
170498
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122C