Packaging

Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

K&S Tab Bonder ultrasonically welds thin metal tabs or fingers to make electrical connections.

University Tag Number: 
171747
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wire Bonding

K&S 8028 Wire Bonder ltrasonically welds very thin gold wire (0.001 thick, 25 micron) to make electrical connections.

University Tag Number: 
171746
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Encapsulation

The Elite Etch from RKD Engineering is an Automated Mixed Acid Decapsulator that enables high productivity through the integration of advanced features, made possible by the use of modern materials and design concepts. RKD’s Elite Etch Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro aliquots of nitric, sulfuric, or mixes of these acids to the package with no sample damage.

University Tag Number: 
182194
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
124A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Encapsulation

Milara Screen Printer precisely prints solders, adhesives, and polymers through stencil or screen to join or protect electronic assemblies. An automated water-jet apparatus was designed and fabricated at NDSU for screening microbial adhesion. The system consists of a robotic arm that is mounted on a stainless steel deck which can access coating array plates from one of three plate stacking hotels. The robotic arm inverts each well of an array plate over an offset, rotating nozzle that delivers a jet of water perpendicular to the coating surface.

University Tag Number: 
170438
Availability: 
Contact Custodian for availability
  • James Bahr
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Dicing

ADT Dicing Saw (cuts) wafers into individual chips or cuts substrates into individual packages

University Tag Number: 
171794
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wire Bonding

Typically, “ball bonding” applications are associated with thermocompression (T/C) and thermosonic (T/S) joining methods.  T/C utilizes pressure and temperature from about 150 degrees C (for most common applications) to create an intermetallic bond.  T/S, on the other hand, adds ultrasonic energy from the previous process.  With both methods, however, a “free air ball” is being created by a spark from an “electronic flame off” or EFO underneath the capillary before bonding takes place.

University Tag Number: 
173162
Availability: 
Unknown
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Encapsulation

The compact dimensions, ease of operation, and high standards of convenience characterize the Leica EG1160 paraffin embedding station.

The separately-heated paraffin dispensing system with an integrated filter provides constant, reproducible paraffin flow at ten different flow rate settings.

University Tag Number: 
168487
Availability: 
Contact Custodian for availability
  • Sheri Dorsam
Location
Hultz Hall
Room Number: 
119B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Encapsulation

OPTEK Laminator laminates material layers together under heat and pressure.

University Tag Number: 
173006
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

West Bond Manual Wire Bonder ultrasonically welds very thin aluminum or gold wire to make electrical connection.

University Tag Number: 
173261
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Encapsulation

Hanmi Molding Compound Pellet Preheater preheats plastic pellets for use in the molding press. Molds thermoset plastics over components or assemblies for their protection and packaging.

University Tag Number: 
173007
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126B