Used to create a patterned layer of metal on a conductive surface. Capable of electroplating both 150mm and 200mm wafers. Plating height can range from a few microns to fifty or more. Up to 900 ma current.
CMS-18 thin film deposition system offers wide possibilities for preparation of known and new materials and structures in the form of thin films.
Four magnetron sources allow preparation of various materials (metal, semiconductor, dielectric, metastable etc.) in a wide range of compositions and structures using deposition, code position, sequential deposition and reactive deposition processes.
The Lesker CMS 18 Deposition System (PVD 4) is a 4 source RF, 2 source pulsed DC sputter deposition system. Each source can accommodate 3” diameter targets of maximum 0.250” thickness. Conductors are best suited for DC sputtering. Insulators are best suited for RF sputtering. Oxide/nitride deposition is also possible via reactive sputtering, by utilizing pulsed DC sputtering and careful gas flow control.
Cressington 108 Sputter Coaters are ideal for routine sample preparation. Compact, economical and simple to operate, they offer rapid pumpdown times, fine-grain coatings and negligible sample heating. Cool, fine-grain sputtering is achieved with a very efficient dc magnetron head. A quick-change target method allows a range of metals to be used. The safety interlocked sputtering supply is fully variable and setting the sputter current is not influenced by vacuum level.
The Cressington Coater offers real solutions to the problems encountered when coating difficult samples for FE-SEM. To minimize the effects of grain size the unit offers a full range of coating materials and gives unprecedented control over thickness and deposition conditions. To minimize charging effects the stage design and wide range of operating pressures allows precise control of the uniformity and conformity of the coating. The HIGH/LOW chamber configuration allows easy adjustment of working distance.
FUJIFILM Dimatix has leveraged its piezoelectric inkjet technology and MEMS fabrication processes with its extensive inkjet product and system knowledge to produce a materials printer specifically designed for R&D and feasibility testing.
The Dimatix Materials Printer (DMP) is a cost-effective, easy-to-use precision materials deposition system.
The KSV Minimicro is a small and elegant Langmuir and Langmuir-Blodgett (LB) device brilliant for depositions on small substrates or to minimize sample volumes. Promising methods for the preparation of thin films as it enables
(A) precise control of the monolayer thickness,
(B) homogeneous deposition of the monolayer over large areas and
(C) the possibility to make multilayer structures with varying layer composition.
The MB-EcoVap tool is a high quality economic research solution when the available laboratory space is restricted. Even though compact in design all essential features for high-quality functional coatings are incorporated in its standard configuration, making it the perfect entry model for many research groups who have decided to take the first steps in exploring vacuum coating technology. Choosing from a comprehensive set of optional upgrades the MB-EcoVap system can be equipped to meet even more advanced requirements from experienced users.
Oxford Plasmalab 100 PECVD
Liquid and solid precursor to system modified Nitride and Si02 films. Boron and silicon carbide deposition. Anamorphous silicon deposition single wafer load lock capable of 100 mm to 200 mm. System modified for Liquid and Solid Precursor deposition.
A plasma jet is a plasma source where a pair of metal electrodes with a sharp point, contained in a cylinder made of dielectric material, and is connected to a high voltage generator. A stream of Helium or Argon is blown in the insulated cylinder so that the electrode finds itself in contact with the gas. Due to the high electric field near the electrode’s sharp point, Helium or Argon ionizes and a mixture of electrons, ions and metastable atoms and molecules is blown by the flow stream towards the exit nozzle.