Packaging

Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

The WS-400 is a single wafer, manual dispense spin processor with a nitrogen purged process chamber and is manipulated by a digital controller.  The wafer is held in place during process by means of a vacuum chuck.  The digital controller has twenty programs each with fifty-one steps stored in non-volatile memory.  The program sizes and steps can be changed.

University Tag Number: 
173091
Availability: 
Contact Custodian for availability
  • Gordon Bierwagen
Location
Research 1
Room Number: 
168
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

Used to develop photo resist on wafers and substrates up to 230 mm. Adjustable speed from 50 to 8,000 rpm with ±10 rpm resolution. Dual N2 aspirated atomizing nozzles. Constant 2-3 psi nozzle pressure regardless of fluid level.

University Tag Number: 
178572
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122B
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wire Bonding

The Type-36 is one of the smallest and fastest core alignment fusion splicers available today. It s a portable, fully automatic, self-contained instrument for creating low-loss optical fiber splices in both field and factory environments. Sumitomo s innovative dual microscope fiber observation system eliminates the need for mirrors, providing faster operation and reduced damage potential. It is designed to work with a variety of fiber types including single-mode, multimode, dispersion shifted, and other specialty fiber.

University Tag Number: 
188076
Availability: 
Contact Custodian for availability
  • Ying Huang
Location
Ehly Hall
Room Number: 
115
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

Places many types and sizes of die on various size substrates.

University Tag Number: 
173261
Availability: 
Contact Custodian for availability
  • Frederik Haring
Location
Research II
Room Number: 
126A
Inventory Classification
  • Process Equipment: Physical
  • Packaging
  • Wafer/Chip Bonding

Hexamethyldisilazane (HMDS) is used to improve photoresist adhesion to the silicon wafers. Programmable cycles for HMDS application. Capable throughput of 400+ wafers per hour.

University Tag Number: 
170494
Availability: 
Contact Custodian for availability
  • Greg Strommen
Location
Research II
Room Number: 
122B