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Tresky Semi-Automated Die Bonder

Inventory Classification

• Process Equipment: Physical
• Packaging
• Wafer/Chip Bonding

Places many types and sizes of die on various size substrates.

University Tag Number: 

173261

Availability: 

Contact Custodian for availability

Custodian

• Frederik Haring

Department

• RCA Research Operations

Location

Research II

Room Number: 

126A

Acquisition Date: 

May 22, 2007