This covers equipment which produces a sample or specimen through physical or mechanical means or through chemical routes, but excluding biochemical and biomolecular processes.
ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in separate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.
This glovebox uses a touch panel control system to regulate a controlled inert atmosphere within the box. The glovebox is used to work with any chemical or material that is sensitive to oxygen and/or moisture.
Coatings requiring Ultra-Violet radiation to initiate curing can be run through our LC6B Benchtop ConveyorTM from Fusion UV. This unit features high power industrial UV irradiators with bulbs that are easily changed to obtain the desired spectral output. Samples are fed through on a conveyor belt where UV dosage is controlled by the conveyor belt speed.
The Whitley Workstation DG250 is the most compact and flexible anaerobic chamber available. The following are key features and benefits of the Whitley Workstation DG250 .
Whitley's cabinets are made of rigid polycarbonate shell provides for excellent visibility to contents inside cabinet. The rigid design allows for a controlled level of positive pressure by means of an independent diaphragm pressure switch.
Unique 'rapid lock' manually-operated portholes allow both access for the operator's arms and the transfer of up to 20 x 90mm Petri dishes.
Free-standing unit with integrated cart, motorized Z-axis, auto focus, X-Y beam positioning system with RACER™ motion technology, self-adjusting spring loaded sealed bearings, stationary processing table, Quick Change Laser Cartridge™ shielded optics, interchangeable focusing optics, flash upgradeable electronics, job complete indicator, system status indicator, relocatable origin, enhanced vector cutting, 3D engraving and rubber stamp mode. 32” x 18” work area.
Hexamethyldisilazane (HMDS) is used to improve photoresist adhesion to the silicon wafers. Programmable cycles for HMDS application. Capable throughput of 400+ wafers per hour.
